Qualcomm’s next flagship smartphone SoC, expected to be called the Snapdragon 875, is quite far off right now. However, a new report from 91Mobiles has given us some insight into the specifications of the chipset.
- Kryo 685 CPU
- 3G/ 4G/ 5G modem –Millimeter wave (mmWave) and sub-6 GHz bands
- Adreno 660 GPU, Adreno 665 VPU, Adreno 1095 DPU
- Qualcomm Secure Processing Unit (SPU250)
- Spectra 580 ISP
- Snapdragon Sensor Core Technology
- External 802.11ax, 2×2 MIMO, and Bluetooth Milan
- Compute Hexagon DSP with Hexagon Vector eXtensions and Hexagon Tensor Accelerator
- Quad-channel package-on-package (PoP) high-speed LPDDR5 SDRAM
Qualcomm is expected to launch the Snapdragon 875 Mobile Platfrom at its Tech Summit in December this year, which means this is a really early report. Moreover, since we can’t independently verify the source, we would suggest you take this information with a pinch of salt.
